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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/094273
Kind Code:
A1
Abstract:
Disclosed is a curable composition using an amidine compound as a non-organic tin catalyst, which is good in elongation, flexibility, surface curability, deep-section curability and adhesion. Specifically disclosed is a curable composition containing (A) an organic polymer having a silicon-containing group represented by the following general formula (1): -SiR1X2, which polymer can be crosslinked by forming a siloxane bond, (B) an amidine compound (B-1) as a silanol condensation catalyst, and (C) a carboxylic acid. In this curable composition, the ratio between the total mole number (b) of nitrogen atoms in the component (B-1) and the total mole number (c) of carboxyl groups in the component (C) ((b)/(c)) is higher than 2.

Inventors:
MATSUSHITA NORIKO (JP)
WAKABAYASHI KATSUYU (JP)
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2007/052419
Publication Date:
August 23, 2007
Filing Date:
February 09, 2007
Export Citation:
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Assignee:
KANEKA CORP (JP)
MATSUSHITA NORIKO (JP)
WAKABAYASHI KATSUYU (JP)
OKAMOTO TOSHIHIKO (JP)
International Classes:
C08L101/10; C08K5/09; C08K5/31; C08L23/26; C08L33/14; C08L71/02; C09J123/00; C09J133/04; C09J171/02; C09J201/10; C09K3/10
Domestic Patent References:
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Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi, Osaka 88, JP)
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