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Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/094275
Kind Code:
A1
Abstract:
Disclosed is a curable composition which exhibits practical curability without using a harmful organotin curing catalyst. Further disclosed is a curable composition which has good tensile properties and good weather resistance, while securing practical surface curability and deep-section curability. Specifically disclosed is a curable composition characterized by containing (A) 1-80 parts by weight of an organic polymer having a reactive silicon group such as an alkyldialkoxysilyl group in a molecule, (B) 99-20 parts by weight of an organic polymer having a reactive silicon group such as a trialkoxysilyl group in a molecule, wherein the main chain backbone has a repeating unit different from that of the component (A), and (C) 0.1-30 parts by weight of a guanidine compound per 100 parts by weight of the total of the component (A) and the component (B).

Inventors:
YANO AYAKO (JP)
MATSUSHITA NORIKO (JP)
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2007/052421
Publication Date:
August 23, 2007
Filing Date:
February 09, 2007
Export Citation:
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Assignee:
KANEKA CORP (JP)
YANO AYAKO (JP)
MATSUSHITA NORIKO (JP)
OKAMOTO TOSHIHIKO (JP)
International Classes:
C08L101/10; C08K5/00; C08K5/31; C08L23/26; C08L33/14; C08L71/02; C09J123/26; C09J133/04; C09J143/04; C09J171/02; C09J201/10; C09K3/10
Foreign References:
JP2004002494A2004-01-08
JP2005248175A2005-09-15
JP2004083606A2004-03-18
JP2003313418A2003-11-06
Other References:
See also references of EP 1992665A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi, Osaka 88, JP)
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