Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/142067
Kind Code:
A1
Abstract:
Disclosed is a curable composition having good adhesion to a thermoplastic polyolefin substrate. The curable composition comprises: (A) a polyoxyalkylene polymer having a reactive silicon group; (B) a polyolefin polymer; and (C) an adhesion-imparting resin. It is possible to provide a curable resin composition having excellent adhesion to a thermoplastic polyolefin substrate by using a hydroxyl-containing hydrogenated petroleum resin as the adhesion-imparting resin (C).
Inventors:
KAWAKAMI ATSUSHI (US)
NAKAMURA SEIGO (BE)
NAKAMURA SEIGO (BE)
Application Number:
PCT/JP2007/060824
Publication Date:
December 13, 2007
Filing Date:
May 28, 2007
Export Citation:
Assignee:
KANEKA CORP (JP)
KANEKA TEXAS CORP (US)
KAWAKAMI ATSUSHI (US)
NAKAMURA SEIGO (BE)
KANEKA TEXAS CORP (US)
KAWAKAMI ATSUSHI (US)
NAKAMURA SEIGO (BE)
International Classes:
C08L71/02; C08L23/28; C08L57/02; C09J123/28; C09J171/02; C09J183/04
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Other References:
See also references of EP 2025715A4
Attorney, Agent or Firm:
OZAKI, Yuzo et al. (13-9 Nishinakajima 5-chome,Yodogawa-k, Osaka-shi Osaka 11, JP)
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