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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/070894
Kind Code:
A1
Abstract:
Provided is a curable composition which exhibits improved adhesion to a polyethylene resin substrate and an ionomer resin substrate, though publicly known curable compositions which contain a polyoxyalkylene polymer bearing a reactive silicon group are less susceptible to adhering to both substrates.  The curable composition comprises (A) a polyoxyalkylene polymer bearing a reactive silicon group, (B) a modified styrene/ethylene/butylene block copolymer, and (C) a liquid polyolefin polymer.

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Inventors:
NAKAMURA SEIGO (BE)
Application Number:
PCT/JP2009/006916
Publication Date:
June 24, 2010
Filing Date:
December 16, 2009
Export Citation:
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Assignee:
KANEKA CORP (JP)
NAKAMURA SEIGO (BE)
International Classes:
C08L71/02; C08L9/00; C08L53/02; C09J109/00; C09J153/02; C09J171/02
Domestic Patent References:
WO2007142067A12007-12-13
Foreign References:
JP2004323843A2004-11-18
JPH0679779A1994-03-22
JPH04110381A1992-04-10
JPH05193061A1993-08-03
JPH03504985A1991-10-31
Attorney, Agent or Firm:
KANEKA CORPORATION (JP)
KANEKA Co. (JP)
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