Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/133564
Kind Code:
A1
Abstract:
Provided is a curable composition that includes an organic polymer having a reactive silicon group that can be used as a sealing material or an adhesive having excellent tensile properties, curing delay after being stored, and depth of cure. The curable composition comprises: (A) an organic polymer having a reactive silicon group; (B) at least one type of ester compound selected from the group comprising an isophthalic acid ester compound, a terephthalic acid ester compound, a 1,3-cyclohexane dicarboxylic acid ester compound, and a 1,4-cyclohexane dicarboxylic acid ester compound (however, excluding compounds having a methyl ester group); and (C) a compound having a methyl ester group.
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Inventors:
YANO AYAKO (JP)
KASAI MITSUHIRO (JP)
KASAI MITSUHIRO (JP)
Application Number:
PCT/JP2015/056468
Publication Date:
September 11, 2015
Filing Date:
March 05, 2015
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L101/10; C08K5/10; C08K5/12; C08K5/57; C08L33/04; C08L71/02; C09J11/06; C09J171/02; C09J201/10; C09K3/10
Domestic Patent References:
| WO2004069923A1 | 2004-08-19 | |||
| WO2008027463A1 | 2008-03-06 | |||
| WO2009113538A1 | 2009-09-17 |
Foreign References:
| JP2006022169A | 2006-01-26 | |||
| JP2006193603A | 2006-07-27 | |||
| JP2010095704A | 2010-04-30 | |||
| JP2010209205A | 2010-09-24 | |||
| JP2011153192A | 2011-08-11 | |||
| JP2012511071A | 2012-05-17 | |||
| JP2013534951A | 2013-09-09 |
Other References:
See also references of EP 3115419A4
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)
Hisakazu Ueki (JP)
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