Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/035602
Kind Code:
A1
Abstract:
When forming a curing pattern by photolithography from a conventional curable composition, a concomitant problem was the low residual film ratio of the cured pattern after development. Residual film ratio refers to the value represented by expression (z) below.
Residual film ratio (%) = Td/Te×100 (z)
[In expression (z), Td represents the film thickness of a cured pattern, and Te represents the film thickness of the composition layer after photoirradiation.] This curable composition contains quantum dots, a polymerization initiator, a polymerizable compound and a thiol compound. The thiol compound has two or more sulfanyl groups in the molecule.
Inventors:
SHIROUCHI KIMIYUKI (JP)
Application Number:
PCT/JP2015/073785
Publication Date:
March 10, 2016
Filing Date:
August 25, 2015
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08F2/44; B82Y30/00; C08F2/50; C08F291/00; C08F292/00; F21V9/16; G03F7/004; H01L21/027
Domestic Patent References:
| WO2012164284A2 | 2012-12-06 |
Foreign References:
| JP2002241509A | 2002-08-28 | |||
| JP2003137912A | 2003-05-14 | |||
| JP2006514711A | 2006-05-11 | |||
| JP2009067828A | 2009-04-02 | |||
| JP2010039475A | 2010-02-18 | |||
| JPH11184084A | 1999-07-09 | |||
| JP2011225484A | 2011-11-10 | |||
| JP2007206600A | 2007-08-16 | |||
| JP2014162816A | 2014-09-08 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
Nakayama 亨 (JP)
Nakayama 亨 (JP)
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