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Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/199270
Kind Code:
A1
Abstract:
Provided are: a curable composition which has good surface curability and provides a cured product that has an excellent balance among elongation, tear strength, heat resistance, storage stability, curability in a deep portion and adhesiveness; a cured product which is obtained by curing this curable composition; and a sealing material and an adhesive, each of which contains this curable composition. The above-described problem is able to be solved by using a curable composition which contains an organic polymer (A) that has a specific highly active reactive silicon group and an organic polymer (B) that is a (meth)acrylic organic polymer which has a certain amount or more of a methyl methacrylate unit in a constituent monomer component.

Inventors:
SATO AKINORI (JP)
Application Number:
PCT/JP2018/017091
Publication Date:
November 01, 2018
Filing Date:
April 26, 2018
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L101/02; C08L33/00; C08L71/00; C08L83/00; C08L83/06
Domestic Patent References:
WO2012020560A12012-02-16
WO2012036109A12012-03-22
Foreign References:
JP2012214755A2012-11-08
JP2012057150A2012-03-22
JP2010111870A2010-05-20
JP2015205984A2015-11-19
JP2015209525A2015-11-24
Attorney, Agent or Firm:
NIIYAMA Yuichi (JP)
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