CURABLE COMPOSITION - DAICEL CORP

Title:

CURABLE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2019/244693

Kind Code:

A1

Abstract:

Provided is a curable composition having excellent workability and being capable of forming a hyperthermostable cured product. This curable composition includes a compound indicated by formula (1) and a solvent. In the formula (1), R1, R2 indicate a curable functional group and D1, D2 indicate a single bond or a linking group. L indicates a divalent group having a repeating unit including a structure indicated by formula (I) and a structure indicated by formula (II). In formulas (I), (II), Ar1–Ar3 indicate groups having two hydrogen atoms removed from an aromatic ring structural formula or groups having two hydrogen atoms removed from a structural formula for at least two aromatic rings bonded by a single bond or a linking group. X indicates –CO–, –S–, or –SO2–. Y indicates –S–, –SO2–, –O–, –CO–, –COO–, or –CONH–. n indicates an integer of at least 0.

Inventors:

ITO DAISUKE (JP)
YOSHIDA TSUKASA (JP)
TAI TOSHIHIRO (JP)
TAMAOKI HITOMI (JP)
SUMIMOTO SATORU (JP)

Application Number:

PCT/JP2019/022923

Publication Date:

December 26, 2019

Filing Date:

June 10, 2019

Export Citation:

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Assignee:

DAICEL CORP (JP)

International Classes:

C08L71/10; C08F32/04; C08F38/00; C08K5/00; C09D7/20; C09D201/06; C09J11/06; C09J201/06

Domestic Patent References:

WO2017169738A1	2017-10-05
WO2018107929A1	2018-06-21

Foreign References:

US7897715B1	2011-03-01
JP2003213130A	2003-07-30
JP2000248252A	2000-09-12
JP2001323067A	2001-11-20
JPH01110530A	1989-04-27
JPH08333450A	1996-12-17
JPH0912882A	1997-01-14
JP2018117284A	2018-07-26
JP2000219741A	2000-08-08
JPS6032642B2	1985-07-29

Other References: