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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/167011
Kind Code:
A1
Abstract:
Provided is a curable composition which contains a polymer having a hydrolyzable silyl group and which has improved adhesiveness to polyolefin-based materials. The curable composition comprises (A) a (meth)acrylic-ester-based polymer having a hydrolyzable silyl group, (B) a chlorinated polyolefin resin, and (C) a nitrogen-containing dialkoxysilane compound. The curable composition may further contain a compound (D) having a guanidino group or a polyoxyalkylene-based polymer (E) having a hydrolyzable silyl group.

Inventors:
ZHANG DONG
Application Number:
PCT/JP2023/005683
Publication Date:
September 07, 2023
Filing Date:
February 17, 2023
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08L33/04; B32B7/12; B32B27/32; C08F20/10; C08G65/336; C08K5/31; C08K5/544; C08L23/28; C08L71/02; C09J11/06; C09J127/04; C09J133/14
Domestic Patent References:
WO2022049931A12022-03-10
Foreign References:
JP2019147925A2019-09-05
JP2013095873A2013-05-20
JP2013060589A2013-04-04
JP2007269935A2007-10-18
JP2013231154A2013-11-14
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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