Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/182492
Kind Code:
A1
Abstract:
The present invention provides a curable composition which can form cured objects having both a low degree of thermal expansion and a low modulus. The present invention relates to a curable composition comprising (A) an epoxy compound having two or more alicyclic epoxy groups, (B) an inorganic filler, (C) hollow organic-polymer particles, and (D) a cationic-polymerization initiator.
Inventors:
NATORI NAOKI (JP)
TOMINAGA TAIGA (JP)
TOMINAGA TAIGA (JP)
Application Number:
PCT/JP2023/011801
Publication Date:
September 28, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08L63/00; C08G59/24; C08G65/18; C08K3/013; C08K7/22; C09J163/00
Foreign References:
| JP2015168687A | 2015-09-28 | |||
| JP2021088635A | 2021-06-10 | |||
| JP2012528205A | 2012-11-12 | |||
| JP2019116556A | 2019-07-18 | |||
| JP2018119031A | 2018-08-02 | |||
| US20200115572A1 | 2020-04-16 | |||
| JP2010001346A | 2010-01-07 |
Attorney, Agent or Firm:
KAMADA, Mitsunori et al. (JP)
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