Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/058586
Kind Code:
A1
Abstract:
The present invention provides a curable composition, a thermal interface material (TIM), and uses thereof. According to the present invention, the curable composition or thermal interface material can exhibit high thermal conductivity while exhibiting low adhesiveness to a predetermined adherend. In addition, the low adhesiveness may be achieved without using an adhesiveness-adjusting component such as a plasticizer, or while minimizing the proportion thereof. Moreover, the curable composition can exhibit a precisely controlled curing speed and have excellent curing properties. The present invention also provides a product comprising the curable composition, a cured body thereof, or the thermal interface material.
Inventors:
SON HO YEON (KR)
LEE JEONG HYUN (KR)
JUN SHIN HEE (KR)
LEE JEONG HYUN (KR)
JUN SHIN HEE (KR)
Application Number:
PCT/KR2023/013865
Publication Date:
March 21, 2024
Filing Date:
September 15, 2023
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08G18/34; C08G18/24; C08G18/42
Foreign References:
| JP2011178899A | 2011-09-15 | |||
| KR20220043762A | 2022-04-05 | |||
| KR20210030235A | 2021-03-17 | |||
| KR20190122451A | 2019-10-30 | |||
| KR20210121150A | 2021-10-07 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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