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Patent Searching and Data


Title:
CURABLE COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO/2004/074381
Kind Code:
A1
Abstract:
The invention aims at providing curable compositions which are excellent in heat resistance and weather resistance and exhibit high strength with the rubber elasticity being retained. A curable composition comprising a vinyl polymer (I) which has at least one crosslinking silyl group and whose backbone chain is produced by living radical polymerization and a vinyl polymer (II) which has a crosslinking silyl group and whose backbone chain is produced by free radical polymerization; and a curable composition comprising a vinyl polymer (III) which has a crosslinking silyl group and exhibits a glass transition temperature of lower than 23°C as determined by a differential scanning calorimeter (DSC) and a vinyl polymer (IV) which has a crosslinking silyl group and exhibits a glass transition temperature of 23°C or above as determined by DSC.

Inventors:
HASEGAWA NOBUHIRO (JP)
NAKAGAWA YOSHIKI (JP)
Application Number:
PCT/JP2004/001743
Publication Date:
September 02, 2004
Filing Date:
February 17, 2004
Export Citation:
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Assignee:
KANEKA CORP (JP)
HASEGAWA NOBUHIRO (JP)
NAKAGAWA YOSHIKI (JP)
International Classes:
C08L43/04; (IPC1-7): C08L101/00; C08L43/00; C08L33/04
Foreign References:
JP2001011319A2001-01-16
JPH02296871A1990-12-07
JPH05140248A1993-06-08
JP2000154255A2000-06-06
JP2000154347A2000-06-06
JP2000154370A2000-06-06
JP2000143853A2000-05-26
JP2001089676A2001-04-03
JPH03277646A1991-12-09
JPH021859A1990-01-08
JPH09272714A1997-10-21
JPH115815A1999-01-12
JPH1143512A1999-02-16
JPH1180571A1999-03-26
JPH11116617A1999-04-27
JPH11130931A1999-05-18
JP2000086999A2000-03-28
JP2000191912A2000-07-11
JP2000038404A2000-02-08
JP2000044626A2000-02-15
JP2000072804A2000-03-07
JPH11100433A1999-04-13
JPH11116763A1999-04-27
JP2001011319A2001-01-16
JPH02296871A1990-12-07
JPH05140248A1993-06-08
Other References:
See also references of EP 1598402A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi Osaka, 88, JP)
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