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Patent Searching and Data


Title:
CURABLE COMPOUND
Document Type and Number:
WIPO Patent Application WO/2018/107929
Kind Code:
A1
Abstract:
A curable compound which has good solvent solubility and which may form a cured product having super-heat resistance, the structure thereof is represented by the following formula (1). In formula (1), R1 and R2 represent curable functional groups, while D1 and D2 represent single bonds or linking groups. L represents a divalent group having a repeating unit, the repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (in the formulas, Ar1-Ar3 represent a group having two hydrogen atoms removed from a structural formula of an aromatic ring, or a group having two hydrogen atoms removed from a structural formula formed by bonding single bonds or linking groups of two or more aromatic rings. X represents -CO-, -S- or -SO2-, while Y represents -S-, -SO2-, -O-, -CO-, -COO- or -CONH-. N represents an integer greater than or equal to 0).

Inventors:
YANG FEI (CN)
OKANO YOSHIMICHI (JP)
NAKATANI KOUJI (JP)
LIU FENG (CN)
NAKAI MICHIYO (JP)
YAEGASHI TAKAYUKI (JP)
OKAMOTO YUSUKE (JP)
YOSHIDA TSUKASA (JP)
Application Number:
PCT/CN2017/110386
Publication Date:
June 21, 2018
Filing Date:
November 10, 2017
Export Citation:
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Assignee:
DAICEL CORP (JP)
YANG FEI (CN)
International Classes:
C08G73/10; C07C49/786
Foreign References:
US5043419A1991-08-27
JPH08333450A1996-12-17
JPH0912882A1997-01-14
JP2001323067A2001-11-20
JP2003213130A2003-07-30
CN2016110302W2016-12-16
JP2000219741A2000-08-08
Other References:
JOURNAL OF NETWORK POLYMER, JAPAN, vol. 27, no. 4, 2006, pages 221 - 231
POLYMER JOURNAL, vol. 34, no. 3, 2002, pages 209 - 218
POLYMER, vol. 30, 1989, pages 978 - 985
POLYMER, vol. 33, no. 15, 1992, pages 3286 - 3291
See also references of EP 3556793A4
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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