CURABLE EPOXY COMPOSITION, FILM OBTAINED USING SAME, LAYERED FILM, PREPREG, LAYERED BODY, CURED PRODUCT, AND COMPOSITE

Title:

CURABLE EPOXY COMPOSITION, FILM OBTAINED USING SAME, LAYERED FILM, PREPREG, LAYERED BODY, CURED PRODUCT, AND COMPOSITE

Document Type and Number:

WIPO Patent Application WO/2016/067330

Kind Code:

A1

Abstract:

　Provided are: a curable epoxy composition containing a polyvalent epoxy compound (A) having a biphenyl structure and/or a condensed polycyclic structure, a trivalent or higher polyvalent phenol-type epoxy compound (B), and a triazine-structure-containing phenol resin (C); a film obtained using the same; a layered film; a prepreg; a layered body; a cured product; and a composite.

More Like This:

JPH0689115	[Title of Invention] Epoxy resin composition
JPS588409	[Title of the Invention] Persimmon Persimmon vinyl ethylene A A A A A A A
JP2006241296	COMPOSITION FOR CONDUCTIVE MATERIAL, CONDUCTIVE MATERIAL, CONDUCTIVE LAYER, ELECTRONIC DEVICE AND ELECTRONIC EQUIPMENT

Inventors:

FUJIMURA MAKOTO (JP)
SAKANO TAKESHI (JP)

Application Number:

PCT/JP2014/078463

Publication Date:

May 06, 2016

Filing Date:

October 27, 2014

Export Citation:

Click for automatic bibliography generation Help

Assignee:

ZEON CORP (JP)

International Classes:

C08G59/32; B32B15/092; B32B27/38; C08G59/62; C08J5/18; C08J7/043; C08J7/05; H05K1/03

Domestic Patent References:

WO2013027732A1

2013-02-28

Foreign References:

JP2010254819A	2010-11-11
JP2007021763A	2007-02-01

Attorney, Agent or Firm:

TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: CURABLE EPOXY COMPOSITION, FILM, LAYERED FILM, PREPREG, LAYERED BODY, CURED MATERIAL, AND COMPOSITE

Next Patent: CAP TIP REMOVAL DEVICE