Title:
CURABLE EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/038446
Kind Code:
A1
Abstract:
Provided is a curable epoxy resin composition capable of forming a cured product (sealing material) with excellent heat resistance, light resistance, and moisture absorption reflow resistance, and in particular, with excellent thermal shock resistance. This curable epoxy resin composition is characterized by: containing an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by formula (1), and a curing agent (C); containing, as the curing agent (C), a methyl norbornane-2,3-dicarboxylic acid anhydride and a compound represented in formula (2); and having a succinic acid anhydride content of 0.4 wt% or less of the total amount of the curing agent (C).
Inventors:
HIRAKAWA HIROYUKI (JP)
MAETSU NARITOSHI (JP)
MAETSU NARITOSHI (JP)
Application Number:
PCT/JP2013/073005
Publication Date:
March 13, 2014
Filing Date:
August 28, 2013
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C08G59/42; C08G59/26; C08L63/00; C08L67/02; H01L33/56
Domestic Patent References:
| WO2012093589A1 | 2012-07-12 | |||
| WO2003064530A1 | 2003-08-07 |
Foreign References:
| JP2005068234A | 2005-03-17 | |||
| JP2004131623A | 2004-04-30 |
Attorney, Agent or Firm:
GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)
Yukihisa Goto (JP)
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