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Title:
CURABLE EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1997/006199
Kind Code:
A1
Abstract:
A curable epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent for epoxy resins selected from the group consisting of an amine-base curing agent, a modification thereof and a polythiol-base curing agent, and (C) a hygroscopic or adsorbent material, and further containing, when the curing agent (B) is neither the amine-base one nor the modification thereof, (D) at least one catalyst that promotes the reaction of an epoxy group with a mercapto group. The composition may contain 10-200 parts by weight of the hygroscopic or adsorbent meterial (C) per 100 parts by weight of the epoxy resin (A) to give a hygroscopic or adsorbent cured article.

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Inventors:
HIOKI AKIRA (JP)
MORIO KAZUHIKO (JP)
KAWAMURA TETSUSHI (JP)
Application Number:
PCT/JP1995/001557
Publication Date:
February 20, 1997
Filing Date:
August 04, 1995
Export Citation:
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Assignee:
ASAHI DENKA KOGYO KK (JP)
CECA SA (FR)
HIOKI AKIRA (JP)
MORIO KAZUHIKO (JP)
KAWAMURA TETSUSHI (JP)
International Classes:
C08G59/18; C08G59/50; C08G59/56; C08G59/66; C08J9/10; (IPC1-7): C08G59/50; C08G59/40; C08L63/00
Foreign References:
JPS52109553A1977-09-13
JPS61197623A1986-09-01
JPS61133228A1986-06-20
JPS60106826A1985-06-12
JPS6166762A1986-04-05
Other References:
See also references of EP 0870790A4
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