Title:
CURABLE EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2007/111136
Kind Code:
A1
Abstract:
Disclosed is a curable epoxy resin composition characterized by containing a compound having a benzoxazole structure represented by the general formula (I) below. (I) (In the formula, X1 and X2 independently represent a hydrogen atom, a substituent having a phenolic hydroxyl group or a substituent having an epoxy group (provided that X1 and X2 are not hydrogen atoms at the same time), alternatively X1 and X2 may be crosslinked with each other to form a saturated or unsaturated heterocyclic ring having 3-8 atoms which has a substituent having a phenolic hydroxyl group or a substituent having an epoxy group; Y1 represents an oxygen atom or a sulfur atom; Z1 represents an optionally substituted hydrocarbon group having 1-8 carbon atoms or an optionally substituted alkoxy group having 1-8 carbon atoms; m represents an integer of 0-4, and when m is an integer of 2-4, a plurality of Z1's may be the same as or different from each other; n represents an integer of 0-2; and A1 represents a hydrogen atom, a substituent having a phenolic hydroxyl group or a substituent having an epoxy group.)
Inventors:
MORI TAKAHIRO (JP)
Application Number:
PCT/JP2007/055106
Publication Date:
October 04, 2007
Filing Date:
March 14, 2007
Export Citation:
Assignee:
ADEKA CORP (JP)
MORI TAKAHIRO (JP)
MORI TAKAHIRO (JP)
International Classes:
C08G59/26; C07D235/18; C07D263/56; C08G59/40
Domestic Patent References:
| WO2004072053A1 | 2004-08-26 | |||
| WO2004010996A1 | 2004-02-05 |
Foreign References:
| JP2003213086A | 2003-07-30 | |||
| JP2005179404A | 2005-07-07 | |||
| JP2004524289A | 2004-08-12 | |||
| JP2005520794A | 2005-07-14 | |||
| JP2005514382A | 2005-05-19 | |||
| JPH11504928A | 1999-05-11 | |||
| JP2001039034A | 2001-02-13 |
Attorney, Agent or Firm:
HATORI, Osamu (8-6 Akasaka 1-chome,,Minato-ku, Tokyo 52, JP)
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