CURABLE EPOXY RESIN COMPOSITION

WIPO Patent Application WO/2012/091000

A1

Provided is a curable epoxy resin composition that does not adversely affect the physical strength of a cured product and which demonstrates excellent fluidity during molding. This curable epoxy resin composition includes: a curable epoxy resin (I); and an epoxy functional group- and aromatic hydrocarbon group-containing organo polysiloxane (II) having an epoxy equivalent of 3,000 max., containing the aromatic hydrocarbon group in the amount of 45-80 wt%, and having a glass transition temperature of less than 0°C.

JP10170738	POLYMER OPTICAL WAVEGUIDE AND ITS PRODUCTION
JP3218436	EPOXY RESIN COMPOSITION
JP3952143	LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

MASATOMI Toru (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
正富　亨 (〒08 千葉県市原市千種海岸２番２　東レ・ダウコーニング株式会社内 Chiba, 〒2990108, JP)
YOSHIZAWA Takeshi (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
吉沢　武 (〒08 千葉県市原市千種海岸２番２　東レ・ダウコーニング株式会社内 Chiba, 〒2990108, JP)

JP2011/080190

July 05, 2012

December 27, 2011

Click for automatic bibliography generation  

Dow Corning Toray Co., Ltd. (5-1 Otemachi 1-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
東レ・ダウコーニング株式会社 (〒04 東京都千代田区大手町一丁目５番１号 Tokyo, 〒1000004, JP)
MASATOMI Toru (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
正富　亨 (〒08 千葉県市原市千種海岸２番２　東レ・ダウコーニング株式会社内 Chiba, 〒2990108, JP)
YOSHIZAWA Takeshi (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)

C08G59/20; C08K3/36; C08K7/18; C08L63/00; H01L23/29; H01L23/31

SHIGA Masatake et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)

View/Download PDF      PDF Help

Previous Patent: METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

Next Patent: ELECTRODE BINDER COMPOSITION FOR NONAQUEOUS ELECTROLYTE BATTERY, ELECTRODE FOR NONAQUEOUS ELECTROLYT...