CURABLE LIQUID RESIN COMPOSITION

Title:

CURABLE LIQUID RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/1997/046601

Kind Code:

A1

Abstract:

A curable liquid resin composition comprising 100 parts by weight of a liquid (meth)acrylic resin (A) and 1 to 1000 parts by weight of a (meth)acrylic monomer (B) having an unsaturated double bond in its molecule and a number-average molecular weight of not more than 1000, wherein the (meth)acrylic resin (A) is a liquid resin optionally modified, which has a number average molecular weight of 10,000 to 20,000 and a viscosity of 1 to 10,000 P (as measured at 50 �C), comprises an alkyl (meth)acrylate monomer (a-1-1) represented by the formula (1): CH2 = C(R1)COO-R2 (wherein R1 represents a hydrogen atom or CH3; and R2 represents an alkyl group), and/or an alkylene glycol (meth)acrylate monomer (a-1-2) represented by the formula (2): CH2 = C(R1)COO(CnH2nO)mR3 (wherein R1 represents a hydrogen atom or CH3; R3 represents an alkyl or phenyl group; n is an integer of 1 to 3; and m is an integer of 3 to 25), and other polymerizable vinyl monomer (a-2), and is prepared by polymerizing the monomers having an average molecule weight of all the monomers of 100 to 1500. The resin composition can be used as a film forming material and a resin for adhesives, and forms a film, without using any solvent, which can be cured.

Inventors:

KAWASHIMA MIKI (JP)
HORIUCHI KUNIO (JP)
TANAKA HIROAKI (JP)

Application Number:

PCT/JP1997/001871

Publication Date:

December 11, 1997

Filing Date:

June 02, 1997

Export Citation:

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Assignee:

TOYO INK MFG CO (JP)
KAWASHIMA MIKI (JP)
HORIUCHI KUNIO (JP)
TANAKA HIROAKI (JP)

International Classes:

C08F265/06; C08L55/00; C09D4/02; C09D4/06; C09D11/10; C09D155/00; (IPC1-7): C08F265/06; C08L33/04; C09D4/02; C09D11/10

Foreign References:

JPH0827398A	1996-01-30
JPH08269411A	1996-10-15
JPH09104721A	1997-04-22
JPS57171A	1982-01-05
JPH02289611A	1990-11-29

Other References: