Title:
CURABLE LIQUID RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO2003027191
Kind Code:
A3
Abstract:
To provide a radiation-sensitive curable liquid resin composition having excellent applicability and capable of producing a film excelling in hardness, scratch resistance, adhesion, transparency, and appearance of the surface of the film. A curable liquid resin composition comprising: (A) particles prepared by bonding at least one oxide of an element selected from the group consisting of silicon, aluminium, zirconium, titanium, zinc, geranium, indium, tin, antimony, and cerium to a specific organic compound which comprises a polymerizable unsaturated group and a group shown by- X-C (=Y)-NH- (wherein X is NH, O, or S, and Y is O or S), and preferably a silanol group, (B) a compound having two or more polymerizable unsaturated groups in the molecule, (C) a specific alkylene glycol organic solvent, and preferably (D) a polymerization initiator.
Inventors:
TAKASE HIDEAKI (JP)
YAMAGUCHI YOSHIKAZU (JP)
TANABE TAKAYSHI (JP)
YAMAGUCHI YOSHIKAZU (JP)
TANABE TAKAYSHI (JP)
Application Number:
PCT/NL2002/000623
Publication Date:
December 11, 2003
Filing Date:
September 26, 2002
Export Citation:
Assignee:
DSM NV (NL)
TAKASE HIDEAKI (JP)
YAMAGUCHI YOSHIKAZU (JP)
TANABE TAKAYSHI (JP)
TAKASE HIDEAKI (JP)
YAMAGUCHI YOSHIKAZU (JP)
TANABE TAKAYSHI (JP)
International Classes:
C08F220/34; C09D4/00; C08F2/54; C09D183/08; (IPC1-7): C09D5/00; C08F230/08
Domestic Patent References:
| WO1997012942A1 | 1997-04-10 |
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