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Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT COLD RESISTANCE, PATTERN FORMING METHOD, ELECTRONIC COMPONENTS, ETC.
Document Type and Number:
WIPO Patent Application WO/2020/080326
Kind Code:
A1
Abstract:
[Problem] To provide a curable organopolysiloxane composition which has a rheological property suitable for fine pattern forming and precise application by a fine droplet application device such as a jet dispenser, and a pattern forming method using the same. [Solution] A curable organopolysiloxane composition, and a pattern forming method and an electronic component and the like using the curable organopolysiloxane composition, wherein the curable organopolysiloxane composition preferably is hydrosilylation reaction-curable, is finely applied by a jet dispenser or the like, has a viscosity at a strain rate of 1000 (1/s) of 2.0 Pa∙s or less and a viscosity at a strain rate of 0.1 (1/s) which is 50.0 times or more the viscosity at the strain rate of 1000 (1/s), and has a content of silicon atom-bonded aromatic functional groups in a range of 1.0 to 6.0 mass%.

Inventors:
TODA NOHNO (JP)
SUTOH MANABU (JP)
Application Number:
PCT/JP2019/040371
Publication Date:
April 23, 2020
Filing Date:
October 15, 2019
Export Citation:
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Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/07; B05D1/26; B05D7/00; B05D7/24; C08K3/013; C08L83/05
Domestic Patent References:
WO2014050318A12014-04-03
WO2019054370A12019-03-21
WO2019054371A12019-03-21
WO2012050105A12012-04-19
Foreign References:
JP2017179038A2017-10-05
JP2013100516A2013-05-23
JP2014506263A2014-03-13
JP2014503680A2014-02-13
JP2013253210A2013-12-19
JP2015091576A2015-05-14
JP2015091576A2015-05-14
JP2018009127A2018-01-18
JP2001002922A2001-01-09
JPH1012546A1998-01-16
JPS528854B21977-03-11
JPH10195085A1998-07-28
JPS6485224A1989-03-30
JP2014503680W
Other References:
See also references of EP 3868833A4
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