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Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND PROTECTION AGENT OR ADHESIVE COMPOSITION FOR ELECTRICAL/ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2018/043270
Kind Code:
A1
Abstract:
[Problem] To provide: a curable organopolysiloxane composition which has excellent initial adhesiveness improvement effect with respect to various substrates even in a small amount and in the form of a thin layer, and which enables the achievement of high bonding strength after curing, while particularly exhibiting excellent bonding durability; and the like. [Solution] A curable organopolysiloxane composition which contains: (A) an organopolysiloxane having at least two alkenyl groups; (B) a trialkoxysilyl group-containing siloxane having one silicon atom-bonded hydrogen atom in each molecule, while having at least one trialkoxysilyl group; (C) a chain or cyclic organopolysiloxane having two silicon atom-bonded hydrogen atoms in each molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms in each molecule; (E) a catalyst for hydrosilylation reactions; (F) a catalyst for condensation reactions; and (G) a bonding accelerator.

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Inventors:
FUJISAWA TOYOHIKO (JP)
ONISHI MASAYUKI (JP)
Application Number:
PCT/JP2017/030265
Publication Date:
March 08, 2018
Filing Date:
August 24, 2017
Export Citation:
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Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C08L83/07; C08L83/04; C08L83/05; C09J11/06; C09J183/04; C09J183/05; C09J183/07; H01L23/29; H01L23/31
Domestic Patent References:
WO2016038836A12016-03-17
WO2015155950A12015-10-15
Foreign References:
JP2012007057A2012-01-12
JP2001343483A2001-12-14
JP2014114446A2014-06-26
JP2010070599A2010-04-02
JPH0441562A1992-02-12
JP2006348119A2006-12-28
JP2012219113A2012-11-12
JP2011246693A2011-12-08
JPS555991B11980-02-12
JPS528854B21977-03-11
JPH10195085A1998-07-28
JP2007235013A2007-09-13
JP2009135105A2009-06-18
JP2012204016A2012-10-22
JP2002170978A2002-06-14
Other References:
See also references of EP 3508533A4
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