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Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND PROTECTION AGENT OR ADHESIVE COMPOSITION FOR ELECTRICAL/ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2018/043270
Kind Code:
A1
Abstract:
[Problem] To provide: a curable organopolysiloxane composition which has excellent initial adhesiveness improvement effect with respect to various substrates even in a small amount and in the form of a thin layer, and which enables the achievement of high bonding strength after curing, while particularly exhibiting excellent bonding durability; and the like. [Solution] A curable organopolysiloxane composition which contains: (A) an organopolysiloxane having at least two alkenyl groups; (B) a trialkoxysilyl group-containing siloxane having one silicon atom-bonded hydrogen atom in each molecule, while having at least one trialkoxysilyl group; (C) a chain or cyclic organopolysiloxane having two silicon atom-bonded hydrogen atoms in each molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms in each molecule; (E) a catalyst for hydrosilylation reactions; (F) a catalyst for condensation reactions; and (G) a bonding accelerator.

Inventors:
FUJISAWA Toyohiko (2-2, Chigusakaiga, Ichihara-shi Chiba 08, 〒2990108, JP)
ONISHI Masayuki (2-2, Chigusakaiga, Ichihara-shi Chiba 08, 〒2990108, JP)
Application Number:
JP2017/030265
Publication Date:
March 08, 2018
Filing Date:
August 24, 2017
Export Citation:
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Assignee:
DOW CORNING TORAY CO., LTD. (5-1 Otemachi 1-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
C08L83/07; C08L83/04; C08L83/05; C09J11/06; C09J183/04; C09J183/05; C09J183/07; H01L23/29; H01L23/31
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