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Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/155131
Kind Code:
A1
Abstract:
The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane resin represented by average unit formula: (R1 3SiO1/2)a(R1 2SiO2/2)b(R2SiO3/2)c(SiO4/2)d (in the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0

Inventors:
YAMAZAKI, Ryosuke (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
NISHIJIMA, Kazuhiro (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
IIMURA, Tomohiro (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
SUTOH, Manabu (2-2, Chigusakaigan, Ichihara-sh, Chiba 08, 〒2990108, JP)
Application Number:
JP2018/003534
Publication Date:
August 30, 2018
Filing Date:
February 02, 2018
Export Citation:
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Assignee:
DOW CORNING TORAY CO., LTD. (1-5-1, Otemachi Chiyoda-k, Tokyo 04, 〒1000004, JP)
International Classes:
C08L83/07; C08K3/36; C08K5/54; C08L83/05; C09J183/04; C09J183/05; C09J183/07; H01L21/52; H01L33/48
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