Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION, SEMICONDUCTOR SEALANT COMPRISING SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/103654
Kind Code:
A1
Abstract:
A curable organopolysiloxane composition including (A) a curing-reactive organopolysiloxane component obtained by curing or semi-curing reaction of at least two types of organopolysiloxanes in the presence of one type or two or more types of catalysts, and (B) a peroxide, the curable organopolysiloxane composition being non-fluid at 25°C and having a melt viscosity of 8000 Pa∙s or less at 100°C. The present invention provides a curable organopolysiloxane composition and an application for the same, the curable organopolysiloxane composition having hot-melt properties and curing in a short time, having excellent physical strength of the initial cured product thereof, and not being prone to cracking during curing, the resultant cured product having a small coefficient of thermal expansion, and the curable organopolysiloxane composition maintaining high physical strength even when exposed to high temperatures.
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Inventors:
TODA NOHNO (JP)
YAMAZAKI RYOSUKE (JP)
FUJISAWA TOYOHIKO (JP)
YAMAZAKI RYOSUKE (JP)
FUJISAWA TOYOHIKO (JP)
Application Number:
PCT/JP2015/006286
Publication Date:
June 30, 2016
Filing Date:
December 17, 2015
Export Citation:
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
C08L83/04; C08F299/08; C08G77/20; C08K3/00; C08K5/14; H01L33/56
Domestic Patent References:
| WO2013021717A1 | 2013-02-14 |
Foreign References:
| JP2007231195A | 2007-09-13 | |||
| JP2007191629A | 2007-08-02 | |||
| JPH0565414A | 1993-03-19 | |||
| JP2007302829A | 2007-11-22 | |||
| JPH01126317A | 1989-05-18 |
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