Title:
CURABLE POLYMETHYLSILSESQUIOXANE, METHOD FOR CURING THE SAME AND PRODUCTS OF CURING THEREOF
Document Type and Number:
WIPO Patent Application WO/1997/007156
Kind Code:
A1
Abstract:
A curable polymethylsilsesquioxane; products of curing thereof; and processes for the production thereof. More specifically, products of curing of polymethylsilsesquioxane which have a flexibility enough for use as unsupported film, are free from practically problematic crack independent of the thickness of the filmy product, and are excellent in physical properties such as tensile strength; a curable polymethylsilsesquioxane useful as the raw material of the products; and a method for curing the same. The polymethylsilsesquioxane has a molecular weight (M) of 380 to 2000 in terms of polystyrene and is represented by the general formula: [CH3SiO3/2]n[CH3Si(OH)O2/2]m {wherein m and n are positive numbers giving the above molecular weight and satisfying the relationship: 0.034/(M x 10-3) m/(m + n) 0.152/(M x 10-3) + 0.10}. This compound can be cured by heating at 50 to 350 �C. The obtained products of curing have excellent physical and chemical characteristics and therefore are useful as surface-protective coating or heat-resistant coating for various materials.
Inventors:
SAITOH AKIHITO (JP)
ITOH MAKI (JP)
ITOH MAKI (JP)
Application Number:
PCT/JP1996/002292
Publication Date:
February 27, 1997
Filing Date:
August 13, 1996
Export Citation:
Assignee:
DOW CORNING ASIA LIMITED (JP)
SAITOH AKIHITO (JP)
ITOH MAKI (JP)
SAITOH AKIHITO (JP)
ITOH MAKI (JP)
International Classes:
C08G77/06; C08G77/16; C09D183/04; (IPC1-7): C08G77/16; C08G77/06
Foreign References:
| JPH04178428A | 1992-06-25 | |||
| JPH0320331A | 1991-01-29 | |||
| JPS5310700A | 1978-01-31 |
Other References:
See also references of EP 0786489A4
Download PDF:
Previous Patent: SILICON-CONTAINING ORGANIC FLUOROPOLYMERS AND USE OF THE SAME
Next Patent: IMPROVED WAXES FOR ACTUATORS
Next Patent: IMPROVED WAXES FOR ACTUATORS