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Title:
CURABLE POLYSILSESQUIOXANE COMPOUND, PRODUCTION METHOD THEREOF, CURABLE COMPOSITION, CURED PRODUCT AND USE METHOD OF CURABLE COMPOSITION, ETC.
Document Type and Number:
WIPO Patent Application WO/2015/170709
Kind Code:
A1
Abstract:
Provided is a curable polysilsesquioxane compound which has at least one type of constituent unit represented by expression CHR1X0-D-SiO3/2 (In the expression, R1 is a hydrogen atom or an alkyl group of 1-6 carbon atoms, X0 is a halogen atom, a cyano group, or a group represented by the expression OG (in this expression, G represents a protective group for a hydroxyl group), and D represents a divalent organic group of 1-20 carbon atoms optionally having a simple bond or a substituent group.) and which is characterized by having, in the 29Si nuclear magnetic resonance spectrum, a first peak top in the region from -73 ppm, inclusive, to -65 ppm, exclusive, and a second peak top in the region from -82 ppm, inclusive, to -73 ppm, exclusive, and by having substantially no peaks in the region from -65 ppm, inclusive, to -55 ppm, exclusive. Also provided are a curable composition containing the aforementioned compound and a silane coupling agent, a production method of the aforementioned curable compound, a cured product formed by curing the aforementioned composition, and a method of use of the aforementioned composition, etc.

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Inventors:
MATSUI MASAMI (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2015/063217
Publication Date:
November 12, 2015
Filing Date:
May 07, 2015
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C08G77/22; C08G77/06; C08K5/54; C08L83/08; C09J11/06; C09J183/08; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
WO2013141360A12013-09-26
WO2012073988A12012-06-07
WO2011111673A12011-09-15
WO2014069508A12014-05-08
Foreign References:
JP2012197425A2012-10-18
JP2008179811A2008-08-07
Other References:
See also references of EP 3141573A4
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
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