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Patent Searching and Data


Title:
CURABLE PRECURSOR OF AN ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/241748
Kind Code:
A1
Abstract:
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a first part and a second part, wherein the first part comprises: (a) a radically (co) polymerizable (meth) acrylate-based component comprising (i) C1-C 32 (meth) acrylic acid ester monomers; and wherein the second part comprises (b) an initiator; and (c) a vinyl aromatic compound. The present disclosure further relates to a process for making a cured composition from said curable precursor and to the use of said curable precursor for adhesive applications and/or for thermal management applications in the automotive industry.

Inventors:
TONG LINGJIE (CN)
SHAABAN AHMAD (DE)
JUNG ADRIAN T (DE)
SPROTT SASCHA (DE)
KROPP MICHAEL A (US)
LIN BINHONG (CN)
Application Number:
PCT/CN2021/095045
Publication Date:
November 24, 2022
Filing Date:
May 21, 2021
Export Citation:
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Assignee:
3M INNOVATIVE PROPERTIES COMPANY (US)
TONG LINGJIE (CN)
International Classes:
C08F290/14; C09J4/06; C09J175/16
Domestic Patent References:
WO2020178105A12020-09-10
Foreign References:
US20160347975A12016-12-01
JP2017036409A2017-02-16
US5310835A1994-05-10
EP2602887A22013-06-12
EP3736300A12020-11-11
US20070142528A12007-06-21
EP3736300A12020-11-11
EP3127973A12017-02-08
Attorney, Agent or Firm:
CHINA SINDA INTELLECTUAL PROPERTY LIMITED (CN)
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