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Title:
CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT SUBSTRATE, INTERLAYER INSULATING MATERIAL, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/188436
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a curable resin composition that has a high flexibility and good workability before curing and shows a high adhesiveness, high thermal resistance and excellent dielectric properties after curing. Another purpose of the present invention is to provide an adhesive agent, an adhesive film, a circuit substrate, an interlayer insulating material and a printed wiring board each produced by using the curable resin composition. The curable resin composition according to the present invention comprises a curable resin and an imide oligomer, wherein the imide oligomer is an aliphatic diamine residue and/or aliphatic triamine residue-containing imide oligomer having an imide skeleton and an optionally substituted aliphatic diamine residue having 4 or more carbon atoms and/or an optionally substituted aliphatic triamine residue having 4 or more carbon atoms in the main chain, a crosslinkable functional group at a terminus and a molecular weight of not more than 5,000.

Inventors:
WAKIOKA, Sayaka (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
OATARI, Yuta (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
TAKEDA, Kohei (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
SHINDO, Masami (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
SHINJO, Takashi (2-1, Hyakuyama, Shimamotocho, Mishima-gu, Osaka 21, 〒6180021, JP)
KAWAHARA, Yuko (32, Wadai, Tsukuba-sh, Ibaraki 92, 〒3004292, JP)
BABA, Susumu (32, Wadai, Tsukuba-sh, Ibaraki 92, 〒3004292, JP)
HAYASHI, Tatsushi (32, Wadai, Tsukuba-sh, Ibaraki 92, 〒3004292, JP)
Application Number:
JP2019/010905
Publication Date:
October 03, 2019
Filing Date:
March 15, 2019
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 47, 〒5300047, JP)
International Classes:
C08G59/40; C08G73/10; C09J7/35; C09J163/00; C09J179/04; C09J201/00; H05K1/03; H05K3/46
Domestic Patent References:
WO2010128667A12010-11-11
Foreign References:
JP2004323728A2004-11-18
JP2001316469A2001-11-13
JP2016147946A2016-08-18
JP2015117278A2015-06-25
JP2016041797A2016-03-31
JP2011042730A2011-03-03
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (5-36, Miyahara 3-chome Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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