Title:
CURABLE RESIN COMPOSITION AND ADHESIVE AGENT
Document Type and Number:
WIPO Patent Application WO/2022/138807
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a curable resin composition that is superior as a two-component or multi-component epoxy resin composition as compared to the prior art. Provided is a curable resin composition including an epoxy resin, an epoxy curing agent, and polymer particles, wherein either (i) a specific amount of aluminum hydroxide of a specific particle size is further included, (ii) aluminum hydroxide is further included and the polymer particles are of a specific configuration, or (iii) a compound having a specific configuration is further included and the epoxy curing agent is of a specific configuration.
Inventors:
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2021/047831
Publication Date:
June 30, 2022
Filing Date:
December 23, 2021
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/26; B32B7/12; B32B27/38; C08F279/02; C08G59/40; C08K3/22; C08K5/13; C08K5/16; C08K5/54; C08L15/00; C08L51/04; C08L63/00; C08L71/00; C09J11/04; C09J11/06; C09J11/08; C09J109/04; C09J163/00; C09J163/02; C09J171/00; H01M10/613; H01M10/653; H01M50/20
Foreign References:
| JP2017128621A | 2017-07-27 | |||
| JP2010126702A | 2010-06-10 | |||
| JP2005226014A | 2005-08-25 | |||
| JP2000103950A | 2000-04-11 | |||
| JPH08231827A | 1996-09-10 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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