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Title:
LIGHT/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENTS, AND ADHESIVE FOR DISPLAY ELEMENTS
Document Type and Number:
WIPO Patent Application WO/2015/111570
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a light/moisture-curable resin composition that exhibits excellent light shielding properties and adhesive properties. Another purpose of the present invention is to provide an adhesive for electronic components and an adhesive for display elements, said adhesives comprising the light/moisture-curable resin composition. The present invention is a light/moisture-curable resin composition that contains a radically polymerizable compound, a moisture-curable urethane resin, a photo-radical polymerization initiator, and a light shielding agent.

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Inventors:
TAKAHASHI TORU (JP)
KUNIHIRO YOSHITAKA (JP)
YUUKI AKIRA (JP)
KIDA TAKUMI (JP)
Application Number:
PCT/JP2015/051354
Publication Date:
July 30, 2015
Filing Date:
January 20, 2015
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F290/06; C08G18/00; C09J4/00; C09J4/06; C09J11/06; C09J175/04
Foreign References:
JP2001261725A2001-09-26
JP2004018621A2004-01-22
JP2013011879A2013-01-17
JPH0598217A1993-04-20
JP2002030267A2002-01-31
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
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