PHOTO/MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENTS, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND CURED BODY

WIPO Patent Application WO/2021/157624

A1

A photo/moisture curable resin composition according to the present invention contains a radically polymerizable compound, a moisture curable urethane resin and a photopolymerization initiator; the moisture curable urethane resin contains a moisture curable urethane resin that has a polyester skeleton; and if a load of 0.04 MPa is applied to a photocured product thereof obtained by means of ultraviolet light irradiation of 1,000 mJ/cm2, the thickness change ratio before and after the application of load is 50% or less.

JPS5270117	PRODUCTION OF POLYESTER FIBERS WITH MOISTURE-ABSORPTION CHARACTERISTIC S
JP6899629	A composition for forming a heat-resistant porous layer, a separation membrane containing the heat-resistant porous layer, an electrochemical battery using the separation membrane, and a method for producing the separation membrane.
JP2001254049	PEELABLE COATING COMPOSITION

TOMITA YOSHIKI (JP)
YUUKI AKIRA (JP)
KIDA TAKUMI (JP)
TAMAGAWA TOMOKAZU (JP)
JO KON (JP)

PCT/JP2021/003989

August 12, 2021

February 03, 2021

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SEKISUI CHEMICAL CO LTD (JP)

C08F283/00; C08F2/44; C08F2/50; C08F290/06; C08G18/10; C08G18/30; C08G18/42; C08L75/04; C09J4/00; C09J11/04; C09J11/06; C09J11/08; C09J175/06; C09J175/08

WO2016163353A1

2016-10-13

JP2016074826A	2016-05-12
JP2008248152A	2008-10-16
JP5999828B1	2016-09-28

TAGUCHI, Masahiro et al. (JP)

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