CURABLE RESIN COMPOSITION, ADHESIVE, IMIDE OLIGOMER, IMIDE OLIGOMER COMPOSITION, AND CURING AGENT

WIPO Patent Application WO/2018/139558

A1

The purpose of the present invention is to provide: an imide oligomer that can be used in a cured product having a high glass transition temperature after curing, and having excellent thermal decomposition resistance, adhesiveness, and long-term thermal resistance; and a curable resin composition and the like containing said imide oligomer. The present invention is a curable resin composition that contains a curable resin and imide oligomers, and that contains, as the imide oligomers, at least one of an imide oligomer that has the structure of formula (1-1) and a number average molecular weight of 900-4000, and an imide oligomer having the structure of formula (1-2) and a number average molecular weight of 550-4000. A is a tetravalent group represented by formula (2-1) or formula (2-2). B is a divalent group represented by formula (3-1) or formula (3-2). Ar is an optionally-substituted divalent aromatic group. The * is a bonding position. Z is a bond or the like. The hydrogen atom of the aromatic ring in formula (2-1), formula (2-2), formula (3-1), and formula (3-2) may be optionally substituted.

TAKEDA KOHEI (JP)
WAKIOKA SAYAKA (JP)
OATARI YUTA (JP)
SHINJO TAKASHI (JP)
SHINDO MASAMI (JP)

PCT/JP2018/002367

August 02, 2018

January 26, 2018

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SEKISUI CHEMICAL CO LTD (JP)

C08G73/10; C08G59/40

WO2005100433A1

2005-10-27

JP2008063298A	2008-03-21
JP2012097206A	2012-05-24
JP2008255249A	2008-10-23
JP2007091799A	2007-04-12
JP2011222810A	2011-11-04
JP2010001352A	2010-01-07
JP2009258367A	2009-11-05

YASUTOMI & ASSOCIATES (JP)

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