Title:
CURABLE RESIN COMPOSITION, COMPOSITE BODY, MOLDED BODY, LAMINATE AND MULTILAYER CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2008/047583
Kind Code:
A1
Abstract:
Disclosed is a curable resin composition containing 100 parts by weight of an alicyclic olefin polymer (A), 1-100 parts by weight of a curing agent (B), 10-50 parts by weight of a salt of a basic nitrogen-containing compound and phosphoric acid (C), and 0.1-40 parts by weight of a condensed phosphoric acid ester (D), while having a phosphorus element content of not less than 1.5% by weight. The curable resin composition is excellent in moisture resistance, flame retardancy, surface smoothness, insulation and crack resistance, and enables to obtain a molded body or composite body which hardly generates harmful substances when incinerated. A multilayer circuit board is obtained by such a process wherein the composition is molded into a sheet, then the sheet is arranged and cured on an inner layer substrate for forming an electrically insulating layer, and then a conductor layer is formed on the electrically insulating layer.
Inventors:
FURUSHITA TOMOYA (JP)
Application Number:
PCT/JP2007/069068
Publication Date:
April 24, 2008
Filing Date:
September 28, 2007
Export Citation:
Assignee:
ZEON CORP (JP)
FURUSHITA TOMOYA (JP)
FURUSHITA TOMOYA (JP)
International Classes:
C08L65/00; C08J5/24; C08K3/32; C08K5/3492; C08L45/00; H05K3/46
Foreign References:
| JP2002121394A | 2002-04-23 | |||
| JP2002012773A | 2002-01-15 | |||
| JP2000198907A | 2000-07-18 | |||
| JP2000154322A | 2000-06-06 | |||
| JPH07216145A | 1995-08-15 | |||
| JPH11181271A | 1999-07-06 | |||
| JP2003226818A | 2003-08-15 |
Attorney, Agent or Firm:
KIKUMA, Tadayuki (FREUND MITA 708 14-5, Mita 2-chome, Minato-k, Tokyo 73, JP)
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