Title:
CURABLE RESIN COMPOSITION AND CURED BODY
Document Type and Number:
WIPO Patent Application WO/2020/149377
Kind Code:
A1
Abstract:
This curable resin composition contains a moisture curable resin (A); the cured product of said curable resin composition has a 5 MPa or lower storage modulus at 25% elongation, and there is no more than a 15% reduction in the tensile storage modulus of the cured product of the curable resin composition before and after a 24-hour thermal treatment at 140°C, measured in the temperature range of 50-100°C by a dynamic viscoelastometer.
Inventors:
JO KON (JP)
YUUKI AKIRA (JP)
KIDA TAKUMI (JP)
TAMAGAWA TOMOKAZU (JP)
HAGIWARA KOUHEI (JP)
YUUKI AKIRA (JP)
KIDA TAKUMI (JP)
TAMAGAWA TOMOKAZU (JP)
HAGIWARA KOUHEI (JP)
Application Number:
PCT/JP2020/001367
Publication Date:
July 23, 2020
Filing Date:
January 16, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F2/44; C08F2/50; C08G18/10; C08G18/30; C08G18/44; C08G18/73; C08G18/76; C09J4/06; C09J11/06; C09J175/06
Domestic Patent References:
| WO2015190499A1 | 2015-12-17 |
Foreign References:
| JP2003313531A | 2003-11-06 | |||
| JP2014122299A | 2014-07-03 | |||
| JP2015120323A | 2015-07-02 | |||
| JP2003327647A | 2003-11-19 | |||
| JP2020002261A | 2020-01-09 |
Other References:
See also references of EP 3913028A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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