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Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND THERMAL BASE GENERATOR
Document Type and Number:
WIPO Patent Application WO/2020/170997
Kind Code:
A1
Abstract:
Provided are: a curable resin composition that includes a heterocycle-containing polymer precursor and a compound represented by formula (1-1) indicated below; a cured film obtained by curing the curable resin composition; a laminate including the cured film; a method for producing the cured film; and a semiconductor device including the cured film or the laminate. Also provided is a novel thermal base generator. In formula (1-1), R1 and R2 each independently represent a monovalent organic group, L1 represents a divalent linking group, R3 represents a hydrogen atom or a monovalent organic group, and R1 and R2 may be bonded and form a ring structure.

Inventors:
IWAI YU (JP)
Application Number:
PCT/JP2020/005967
Publication Date:
August 27, 2020
Filing Date:
February 17, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/14; B32B15/08; C08G73/06; C08L79/08; G03F7/004; G03F7/027; G03F7/037; G03F7/20
Domestic Patent References:
WO2018025738A12018-02-08
WO2018151195A12018-08-23
WO2018181182A12018-10-04
Foreign References:
JP2012093746A2012-05-17
JP2009080452A2009-04-16
Attorney, Agent or Firm:
SIKs & Co. (JP)
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