Title:
CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYER BODY, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/189481
Kind Code:
A1
Abstract:
A curable resin composition that contains a polyimide precursor which has at least one branched structure that is selected from the group consisting of branched structures represented by formula (A-1) and branched structures represented by formula (A-2), and which has a branched chain having a repeating unit as a branched chain that is bonded to the branched structure; a cured film which is obtained by curing the above-described curable resin composition; a multilayer body which comprises the above-described cured film; a method for producing the above-described cured film; and a semiconductor device which comprises the above-described cured film or the above-described multilayer body.
In formula (A-1) and formula (A-2), R115 represents a tetravalent organic group; RA21 represents a hydrogen atom or a monovalent organic group; and each * independently represents a binding site to another structure.
Inventors:
OGAWA MICHIHIRO (JP)
YAMAGUCHI SHUHEI (JP)
IWAI YU (JP)
YAMAGUCHI SHUHEI (JP)
IWAI YU (JP)
Application Number:
PCT/JP2020/010733
Publication Date:
September 24, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; B32B15/088; C08G73/12; G03F7/027; G03F7/037; G03F7/20; G03F7/40
Domestic Patent References:
| WO2017043474A1 | 2017-03-16 |
Foreign References:
| JPH11106509A | 1999-04-20 | |||
| JP2016200643A | 2016-12-01 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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