Title:
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/246457
Kind Code:
A1
Abstract:
Provided are: a curable resin composition containing at least one type of resin, which is selected from the group consisting of a polyimide precursor, a polybenzoxazole precursor, a polyimide, and a polybenzoxazole, and a compound B, which is a compound having a polymerizable group and an azole group; a cured film obtained by curing the curable resin composition; a laminate containing the cured film; a method for manufacturing the cured film; and a semiconductor device containing the cured film or the laminate.
Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2021/021067
Publication Date:
December 09, 2021
Filing Date:
June 02, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/16; B32B15/088; B32B27/26; B32B27/34; C08K5/34; C08L79/04; C08L101/02; G03F7/004; G03F7/027; G03F7/037; G03F7/075; G03F7/20
Domestic Patent References:
| WO2020262228A1 | 2020-12-30 |
Foreign References:
| JP2018016865A | 2018-02-01 | |||
| JP2016117901A | 2016-06-30 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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