Title:
CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT
Document Type and Number:
WIPO Patent Application WO/2023/089976
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable resin which can be excellent in terms of heat resistance (high glass transition temperature) and dielectric characteristics (low-dielectric characteristics), a composition of the resin, and a cured object obtained from the resin composition. Specifically, provided is a curable resin (A) characterized by including both a structure represented by general formula (1) and a structure represented by general formula (2). (Details of the substituents and the number of each substituent in general formula (1) are as shown in the description.) (Details of the substituents and the number of each substituent in general formula (2) are as shown in the description.)
Inventors:
MATSUOKA RYUICHI (JP)
YANG LICHEN (JP)
KANNARI HIROYOSHI (JP)
YANG LICHEN (JP)
KANNARI HIROYOSHI (JP)
Application Number:
PCT/JP2022/037366
Publication Date:
May 25, 2023
Filing Date:
October 06, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F20/30; B32B15/08; B32B15/082; B32B15/20; B32B27/30; C08F16/26; C08F299/02; C08G61/02; C08G63/47; C08J5/24; H01L23/14
Domestic Patent References:
| WO2020189598A1 | 2020-09-24 | |||
| WO2020115118A1 | 2020-06-11 | |||
| WO2022038893A1 | 2022-02-24 | |||
| WO2021251052A1 | 2021-12-16 | |||
| WO2021246182A1 | 2021-12-09 | |||
| WO2022137915A1 | 2022-06-30 |
Foreign References:
| JP6962507B1 | 2021-11-05 | |||
| JP2015189925A | 2015-11-02 | |||
| JP2013525568A | 2013-06-20 | |||
| JPH11240931A | 1999-09-07 | |||
| JP2010229263A | 2010-10-14 | |||
| JPH07500865A | 1995-01-26 | |||
| US20100304015A1 | 2010-12-02 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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