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Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF AND PRINTED CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/141124
Kind Code:
A1
Abstract:
In the present invention, in order to form a printed circuit board from a white cured film capable of achieving a high level of balance between pliability and high reflectivity with little reduction in reflectivity over time, a curable resin composition comprises the following: (A) a carboxyl group-containing urethane resin obtained using a non-aromatic compound having iosycyanate groups, (B) an aromatic-ring free, carboxyl group-containing resin; and (C) titanium oxide. The curable resin composition is cured by at least heating or exposure to active energy rays, and a ratio of the (A) carboxyl group-containing urethane resin and the (B) aromatic-ring free, carboxyl group-containing resin is within a range of 50 to 70: 50 to 30 by mass. A thermosetting resin composition contains (D) a thermosetting component, and a photocurable thermosetting resin composition contains (E) a monoacyl phosphine oxide photopolymerization initiator solely, or additionally (F) a bisacyl phosphine oxide photopolymerization initiator.

Inventors:
NISHIO KAZUNORI (JP)
YOSHIDA TAKAHIRO (JP)
Application Number:
JP2012/059645
Publication Date:
October 18, 2012
Filing Date:
April 09, 2012
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
NISHIO KAZUNORI (JP)
YOSHIDA TAKAHIRO (JP)
International Classes:
C08L75/04; B32B27/40; C08K3/22; H05K3/28
Foreign References:
JP2010224171A2010-10-07
JP2011184593A2011-09-22
JP2011174014A2011-09-08
JP2010106266A2010-05-13
JP2001019911A2001-01-23
JP2000345131A2000-12-12
JPH11100528A1999-04-13
JPH05156153A1993-06-22
JPS63308076A1988-12-15
Attorney, Agent or Firm:
Shigeki Yoshida (JP)
YOSHIDA, SHIGEKI (JP)
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Claims: