Title:
CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/056723
Kind Code:
A1
Abstract:
An epoxy resin composition containing a cyclic siloxane compound (A) of a specific structure having two or more epoxy groups in-molecule, an epoxy resin curing agent (B), and an optional epoxy resin curing accelerator (C). The epoxy resin curing agent (B) is preferably a polycarboxylic acid resin or a polycarboxylic acid of a specific structure.
Inventors:
MIYAGAWA NAOFUSA (JP)
SASAKI CHIE (JP)
SHITARA RITSUKO (JP)
TATENO MASAKI (JP)
SASAKI CHIE (JP)
SHITARA RITSUKO (JP)
TATENO MASAKI (JP)
Application Number:
PCT/JP2014/077470
Publication Date:
April 23, 2015
Filing Date:
October 15, 2014
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/20; C08G59/42; H01L23/29; H01L23/31
Domestic Patent References:
| WO2006109768A1 | 2006-10-19 | |||
| WO2012165147A1 | 2012-12-06 | |||
| WO2009060862A1 | 2009-05-14 | |||
| WO2011108588A1 | 2011-09-09 | |||
| WO2012137837A1 | 2012-10-11 |
Foreign References:
| JP2006307128A | 2006-11-09 | |||
| JP2012184394A | 2012-09-27 | |||
| JP2011102337A | 2011-05-26 | |||
| JP2011057617A | 2011-03-24 | |||
| JP2014145073A | 2014-08-14 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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