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Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILDUP FILM, BUILDUP BOARD, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2015/190131
Kind Code:
A1
Abstract:
Provided is a curable resin composition, and the like, having superior fluidity and superior cured produced properties, such as heat resistance, moisture and solder resistance, flame resistance, and dielectric properties. The curable resin composition comprises a resin (A) having the benzoxazine structure represented by structural formula (A1) and epoxy resin (B), wherein when α is the total number of moles of the benzoxazine structure in structural formula (A1) and β is the number of moles of epoxy groups in epoxy resin (B), the ratio [β/α] is 0.1 to 0.5.

Inventors:
SHIMONO Tomohiro (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
ARITA Kazuo (Chiba Plant 12, Yawata-kaigandori, Ichihara-sh, Chiba 85, 〒2908585, JP)
Application Number:
JP2015/054593
Publication Date:
December 17, 2015
Filing Date:
February 19, 2015
Export Citation:
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Assignee:
DIC CORPORATION (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
International Classes:
C08L61/34; C08G14/073; C08G59/40; C08J5/24; C08L63/00; H05K1/03
Foreign References:
JP2011207995A2011-10-20
JP2010053325A2010-03-11
JP2012077243A2012-04-19
JPS4947378A1974-05-08
Other References:
See also references of EP 3156450A4
Attorney, Agent or Firm:
KONO Michihiro (WATERRAS TOWER 101, Kanda Awajicho 2-chome, Chiyoda-k, Tokyo 63, 〒1010063, JP)
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