Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2016/047291
Kind Code:
A1
Abstract:
Provided is a curable resin composition which is characterized by containing no solvent and being cured by active energy ray irradiation and/or by heating, while exhibiting excellent initial curability. This curable resin composition is also characterized in that a cured product thereof has excellent flexibility and excellent thermal yellowing resistance, while exhibiting good adhesion to a base, said adhesion being enough to prevent separation over time.
A curable resin composition which contains a polyether polymer having (A) a repeating unit -CH2C(CH3)2-O- and a (meth)acrylate group; a cured product which is obtained by curing the curable resin composition; and a laminate which comprises the cured product.
Inventors:
NAKAGAWA MAMI (JP)
OHNISHI TOSHIYUKI (JP)
OHNISHI TOSHIYUKI (JP)
Application Number:
PCT/JP2015/072458
Publication Date:
March 31, 2016
Filing Date:
August 07, 2015
Export Citation:
Assignee:
DAI ICHI KOGYO SEIYAKU CO LTD (JP)
International Classes:
C08F290/06; C08F299/02
Domestic Patent References:
| WO2008038838A1 | 2008-04-03 | |||
| WO2009069548A1 | 2009-06-04 |
Foreign References:
| JPH02220047A | 1990-09-03 | |||
| US3509074A | 1970-04-28 | |||
| JP2009134000A | 2009-06-18 | |||
| JP2011132410A | 2011-07-07 |
Other References:
OMICHI, H. ET AL.: "Synthesis of Complexing Copolymers by the Radiation-Induced Grafting Method", INT. J. RADIAT. APPL. INSTRUM. PART C, vol. 30, no. 3, 1987, pages 151 - 156, XP009043384, ISSN: 0146-5724
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