CURABLE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2018/083832

A1

The present invention provides a curable resin composition which has good solubility to silicone resin with no precipitation even when the addition of a rare earth compound is increased and which, when cured, is capable of forming a cured product that has good transparency and excellent heat resistance and is such that an increase in rigidity and embrittlement is inhibited, in particular, under a high temperature condition of about 250°C. This curable resin composition comprises: a polysiloxane (A) which is at least one selected from the group consisting of a polyorganosiloxane (A1) having two or more alkenyl groups in molecules thereof and a polyorganosiloxy silalkylene (A2) having two or more alkenyl groups in molecules thereof; a polysiloxane (B) which is at least one selected from the group consisting of a polyorganosiloxane (B1) having two or more hydrosilyl groups in molecules thereof and a polyorganosiloxy silalkylene (B2) having two or more hydrosilyl groups in molecules thereof; and a rare earth compound (C) represented by formula (1). The content of rare earth metal atoms relative to the total amount of the curable resin composition is 30 to 500 ppm. The rare earth compound (C) represented by formula (1) is as described in the description.

NAKAGAWA YASUNOBU (JP)

PCT/JP2017/022176

May 11, 2018

June 15, 2017

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DAICEL CORP (JP)

C08L83/07; C08K5/07; C08L83/05; C09K3/10; G02B1/04; H01L23/29; H01L23/31

JPS62256863A	1987-11-09
JPS5422755B2	1979-08-08
JP2016222850A	2016-12-28

GOTO & CO. (JP)

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