Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT OF SAID COMPOSITION, METHOD OF PRODUCING SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/181857
Kind Code:
A1
Abstract:
[Problem] To provide a curable resin composition for obtaining a cured product capable of exhibiting both high heat resistance and high adhesion to metals, a cured product of said composition, and a method of producing said curable resin composition and said cured product. Also to provide a semiconductor device using said cured product as a sealant. [Solution] The present invention provides: a curable resin composition containing (A) a polyfunctional benzoxazine compound comprising at least two benzoxazine rings, (B) a polyfunctional epoxy compound comprising at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole compound, and, as desired, (E) a cure accelerator and (F) an inorganic filler; a cured product of said composition; and a method of producing said curable resin composition and said cured product. The present invention also provides a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing the curable resin composition containing components (A) to (D) and, as desired, (E) and (F).
Inventors:
NISHITANI YOSHINORI (JP)
MINAMI MASAKI (JP)
MINAMI MASAKI (JP)
Application Number:
PCT/JP2018/013532
Publication Date:
October 04, 2018
Filing Date:
March 30, 2018
Export Citation:
Assignee:
JXTG NIPPON OIL & ENERGY CORP (JP)
International Classes:
C08G59/40; C08G59/24; C08K5/3472; C08L61/34; C08L63/00; H01L23/29; H01L23/31
Foreign References:
| JP2014136779A | 2014-07-28 | |||
| JP2010138400A | 2010-06-24 | |||
| JP2005248164A | 2005-09-15 | |||
| JP2012188629A | 2012-10-04 | |||
| JP2010013636A | 2010-01-21 | |||
| JP2016153476A | 2016-08-25 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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