Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/193852
Kind Code:
A1
Abstract:
Provided is a curable resin composition which has an excellent fluidity and reactivity during molding, and by which a cured product having an excellent heat resistance and high reliability can be obtained through curing. The curable resin composition includes (A) a polyalkenyl phenol compound having at least two structural units represented by formula 1; and (B) a polymaleimide compound (in the formula, R1 and R2 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, or a hydroxyl group, Q represents a C5-10 cycloalkylene group or a divalent organic group having an alicyclic condensed ring, and Y represents an alkenyl group).
Inventors:
HASEGAWA AOI (JP)
MORI MASATOSHI (JP)
ISHIBASHI YOSHITAKA (JP)
MORI MASATOSHI (JP)
ISHIBASHI YOSHITAKA (JP)
Application Number:
PCT/JP2018/014458
Publication Date:
October 25, 2018
Filing Date:
April 04, 2018
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08F212/34; C08F222/40; C08L61/06
Domestic Patent References:
| WO2016104195A1 | 2016-06-30 |
Foreign References:
| CN103360764A | 2013-10-23 | |||
| JPH0693047A | 1994-04-05 | |||
| JP2015117375A | 2015-06-25 | |||
| JPS6399224A | 1988-04-30 | |||
| JP2014169428A | 2014-09-18 | |||
| JP2016074902A | 2016-05-12 | |||
| JPH07165825A | 1995-06-27 | |||
| JPH0291113A | 1990-03-30 | |||
| JP2011026253A | 2011-02-10 | |||
| JPS6399224A | 1988-04-30 | |||
| JP2016028129A | 2016-02-25 |
Other References:
See also references of EP 3613781A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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