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Title:
CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/193852
Kind Code:
A1
Abstract:
Provided is a curable resin composition which has an excellent fluidity and reactivity during molding, and by which a cured product having an excellent heat resistance and high reliability can be obtained through curing. The curable resin composition includes (A) a polyalkenyl phenol compound having at least two structural units represented by formula 1; and (B) a polymaleimide compound (in the formula, R1 and R2 each independently represent a hydrogen atom, a C1-10 alkyl group, a C1-2 alkoxy group, or a hydroxyl group, Q represents a C5-10 cycloalkylene group or a divalent organic group having an alicyclic condensed ring, and Y represents an alkenyl group).

Inventors:
HASEGAWA, Aoi (13-9 Shiba Daimon 1-chome, Minato-k, Tokyo 18, 〒1058518, JP)
MORI, Masatoshi (13-9 Shiba Daimon 1-chome, Minato-k, Tokyo 18, 〒1058518, JP)
ISHIBASHI, Yoshitaka (13-9 Shiba Daimon 1-chome, Minato-k, Tokyo 18, 〒1058518, JP)
Application Number:
JP2018/014458
Publication Date:
October 25, 2018
Filing Date:
April 04, 2018
Export Citation:
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Assignee:
SHOWA DENKO K.K. (13-9, Shiba Daimon 1-chome Minato-k, Tokyo 18, 〒1058518, JP)
International Classes:
C08F212/34; C08F222/40; C08L61/06
Domestic Patent References:
WO2016104195A12016-06-30
Foreign References:
CN103360764A2013-10-23
JPH0693047A1994-04-05
JP2015117375A2015-06-25
JPS6399224A1988-04-30
JP2014169428A2014-09-18
JP2016074902A2016-05-12
JPH07165825A1995-06-27
JPH0291113A1990-03-30
JP2011026253A2011-02-10
JPS6399224A1988-04-30
JP2016028129A2016-02-25
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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