Title:
CURABLE RESIN COMPOSITION, DRY FILM THEREOF, CURED PRODUCT OF SAID CURABLE RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/029468
Kind Code:
A1
Abstract:
In order to be halogen free and to be able to exert excellent solder heat resistance, electroless gold plating resistance, moisture resistance and resistance to electrode corrosion at a high sensitivity, a curable resin composition contains a curable resin (A) derived from a compound having a structure represented by general formula (1), and a layered double hydroxide (B). The curable resin composition and the dry film thereof can be advantageously used for the formation of a prepreg or a cured coating film such as a solder resist for a printed circuit board or a flexible printed circuit board. (In formula (1), R1 represents a polyhydric alcohol derivative having a valency of (m+l); m and n represent an integer of 1 or more and less than 10, 1 being an integer of 0 or at least 1; R2 represents CH2, C2H4, C3H6, C4H8 or a substituted or non-substituted aromatic ring; and R3 represents a substituted or non-substituted aromatic ring.)
Inventors:
OKAMOTO DAICHI (JP)
ARIMA MASAO (JP)
ARIMA MASAO (JP)
Application Number:
PCT/JP2011/067293
Publication Date:
March 08, 2012
Filing Date:
July 28, 2011
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
OKAMOTO DAICHI (JP)
ARIMA MASAO (JP)
OKAMOTO DAICHI (JP)
ARIMA MASAO (JP)
International Classes:
C08L101/02; C08F299/04; C08K3/18; C08L67/06; G03F7/004; G03F7/027; G03F7/032
Domestic Patent References:
| WO2008013316A1 | 2008-01-31 | |||
| WO2010131649A1 | 2010-11-18 | |||
| WO2011027695A1 | 2011-03-10 | |||
| WO2011021370A1 | 2011-02-24 | |||
| WO2010119493A1 | 2010-10-21 | |||
| WO2010119494A1 | 2010-10-21 |
Foreign References:
| JP2006219567A | 2006-08-24 | |||
| JPH06279662A | 1994-10-04 | |||
| JP2004012810A | 2004-01-15 | |||
| JP2002293910A | 2002-10-09 | |||
| JP2000159859A | 2000-06-13 | |||
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| JP2006233148A | 2006-09-07 | |||
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| JP2002060632A | 2002-02-26 | |||
| JP2010237270A | 2010-10-21 | |||
| JP2010224169A | 2010-10-07 |
Attorney, Agent or Firm:
Shigeki Yoshida (JP)
YOSHIDA, SHIGEKI (JP)
YOSHIDA, SHIGEKI (JP)
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Claims: