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Title:
CURABLE RESIN COMPOSITION, DRY FILM THEREOF, CURED PRODUCT OF SAID CURABLE RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/029468
Kind Code:
A1
Abstract:
In order to be halogen free and to be able to exert excellent solder heat resistance, electroless gold plating resistance, moisture resistance and resistance to electrode corrosion at a high sensitivity, a curable resin composition contains a curable resin (A) derived from a compound having a structure represented by general formula (1), and a layered double hydroxide (B). The curable resin composition and the dry film thereof can be advantageously used for the formation of a prepreg or a cured coating film such as a solder resist for a printed circuit board or a flexible printed circuit board. (In formula (1), R1 represents a polyhydric alcohol derivative having a valency of (m+l); m and n represent an integer of 1 or more and less than 10, 1 being an integer of 0 or at least 1; R2 represents CH2, C2H4, C3H6, C4H8 or a substituted or non-substituted aromatic ring; and R3 represents a substituted or non-substituted aromatic ring.)

Inventors:
OKAMOTO, Daichi (900, Oaza Hirasawa, Ranzan-machi, Hiki-gu, Saitama 15, 〒3550215, JP)
岡本 大地 (〒15 埼玉県比企郡嵐山町大字平澤900番地太陽インキ製造株式会社内 Saitama, 〒3550215, JP)
Application Number:
JP2011/067293
Publication Date:
March 08, 2012
Filing Date:
July 28, 2011
Export Citation:
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Assignee:
TAIYO HOLDINGS CO., LTD. (7-1 Hazawa 2-chome, Nerima-ku Tokyo, 08, 〒1768508, JP)
太陽ホールディングス株式会社 (〒08 東京都練馬区羽沢二丁目7番1号 Tokyo, 〒1768508, JP)
OKAMOTO, Daichi (900, Oaza Hirasawa, Ranzan-machi, Hiki-gu, Saitama 15, 〒3550215, JP)
International Classes:
C08L101/02; C08F299/04; C08K3/18; C08L67/06; G03F7/004; G03F7/027; G03F7/032
Domestic Patent References:
WO2008013316A1
WO2010131649A1
WO2011027695A1
WO2011021370A1
WO2010119493A1
WO2010119494A1
Foreign References:
JP2006219567A
JPH06279662A
JP2004012810A
JP2002293910A
JP2000159859A
JP2002327055A
JP2006233148A
JP2002080706A
JP2002060632A
JP2010237270A
JP2010224169A
Attorney, Agent or Firm:
YOSHIDA, Shigeki (Room 1103, Shinyo Bldg.14-2, Takadanobaba 2-chome, Shinjuku-k, Tokyo 75, 〒1690075, JP)
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Claims:



 
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