Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2015/190210
Kind Code:
A1
Abstract:
Provided are: a curable resin composition that exhibits excellent resolution, toughness and heat resistance; a dry film; a cured product; and a printed wiring board. The curable resin composition contains (A) an amide-imide resin having an alkali-soluble functional group and at least one structure represented by formulae (1) and (2), (B) inorganic particles having an average particle diameter of 200 nm or less, (C) a photopolymerization initiator, and (D) a compound having an unsaturated double bond. The inorganic particles (B) having an average particle diameter of 200 nm or less are preferably silica, and the curable resin composition preferably contains (E) a thermosetting resin.
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Inventors:
SHIBASAKI YOKO (JP)
AKIYAMA MANABU (JP)
ITO NOBUHITO (JP)
AKIYAMA MANABU (JP)
ITO NOBUHITO (JP)
Application Number:
PCT/JP2015/063870
Publication Date:
December 17, 2015
Filing Date:
May 14, 2015
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
G03F7/037; C08F2/44; G03F7/004; H05K3/28
Domestic Patent References:
| WO2010074197A1 | 2010-07-01 |
Foreign References:
| JP2010270293A | 2010-12-02 | |||
| JP2013053075A | 2013-03-21 | |||
| JP2004184879A | 2004-07-02 | |||
| JP2008297231A | 2008-12-11 | |||
| JP2010224319A | 2010-10-07 |
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Ichiro Honda (JP)
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