Title:
CURABLE RESIN COMPOSITION, DRY FILM AND PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/057431
Kind Code:
A1
Abstract:
Provided are: a curable resin composition which enables the achievement of a cured product that has a good balance between flame retardancy and insulation reliability such as ion migration resistance; a dry film which has a resin layer that is obtained from this composition; a cured product of this composition or this dry film; and a printed wiring board which comprises this cured product.
A curable resin composition which contains a carboxyl group-containing resin, a thermosetting component, a flame retardant and an ion scavenger, and which is characterized in that the ion scavenger is a mixture of a hydrotalcite-based ion scavenger and an ion scavenger other than hydrotalcite-based ion scavengers.
Inventors:
MIYABE HIDEKAZU (JP)
YOKOYAMA YUTAKA (JP)
YOKOYAMA YUTAKA (JP)
Application Number:
PCT/JP2016/078573
Publication Date:
April 06, 2017
Filing Date:
September 28, 2016
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G59/40; C08F2/50; C08K3/10; C08K3/22; C08L33/14; G03F7/004; H05K3/38
Foreign References:
| JP2003213083A | 2003-07-30 | |||
| JP2002069270A | 2002-03-08 | |||
| JP2003026776A | 2003-01-29 | |||
| JP2014178708A | 2014-09-25 | |||
| JP2014052599A | 2014-03-20 | |||
| JP2008250305A | 2008-10-16 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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