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Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED ARTICLE, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/128257
Kind Code:
A1
Abstract:
Provided are a curable resin composition from which a cured article can be obtained with excellent resistance to welding and thermal performance and also excellent flexibility and warpage, a dry film, a cured article, and a printed circuit board . The curable resin composition comprises (A) a carboxyl containing resin, (B) a photopolymerization initiator, and (C) an ethylenically unsaturated group-containing compound having five or more alkylene oxide skeletons. As the component (A), it contains (A1) a carboxyl group-containing photosensitive resin formed through enabling an epoxy resin to react with a carboxylic acid having the ethylenically unsaturated group, enabling the resulting hydroxyl to react with an acid anhydride, and adding a compound having a glycidyl and an ethylenically unsaturated group to the resulting carboxyl containing resin. The component (C) contains at least two kinds of ethylenically unsaturated group-containing compounds.

Inventors:
FUKUDA, Shinichiro (No.26 Taishan Road, Suzhou New DistrictSuzhou, Jiangsu 9, 215129, CN)
YAMAMOTO, Shuichi (No.26 Taishan Road, Suzhou New DistrictSuzhou, Jiangsu 9, 215129, CN)
DONG, Siyuan (No.26 Taishan Road, Suzhou New DistrictSuzhou, Jiangsu 9, 215129, CN)
WANG, Yubin (No.26 Taishan Road, Suzhou New DistrictSuzhou, Jiangsu 9, 215129, CN)
Application Number:
CN2018/100676
Publication Date:
July 04, 2019
Filing Date:
August 15, 2018
Export Citation:
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Assignee:
TAIYO INK (SUZHOU) CO., LTD. (No.26 Taishan Road, Suzhou New DistrictSuzhou, Jiangsu 9, 215129, CN)
International Classes:
G03F7/027; C08F2/48; C08F290/06; C08F299/02; C08L63/10; G03F7/004; H05K3/28; H05K3/46
Domestic Patent References:
WO2000068740A12000-11-16
Foreign References:
CN1420998A2003-05-28
CN101220225A2008-07-16
CN101846882A2010-09-29
JP2004062057A2004-02-26
Attorney, Agent or Firm:
LINDA LIU & PARTNERS (F16 Tower C, Beijing Global Trade Center 36 North Third Ring East Road, Dongcheng District, Beijing 3, 100013, CN)
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