Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/142753
Kind Code:
A1
Abstract:
Provided is a curable resin composition that, even if a cured film having sites where a painted membrane of the curable resin composition overlaps is formed upon a circuit board, the adhesion between the substrate (insulated section) and the circuit (conductive section) is maintained and cracks and peeling are unlikely to occur in the cured film. This curable resin composition includes a curable resin and is characterized by A, B, and C all being 1–15 MPa and A and B being 0.5–5 times C, when A (MPa) is the sheer strength between the insulated section and a cured film α when the cured film α comprising a cured product of the curable resin composition is formed upon the surface of the substrate, B (MPa) is the sheer strength between the conductive section and the cured film α when the cured film α comprising a cured product of the curable resin composition is formed upon the surface of the conductive section of the substrate, and C (MPa) is the sheer strength between the cured film α and a cured film β, when the cured film α comprising a cured product of the curable resin composition is formed upon the surface of the cured film β comprising a cured product of the curable resin composition.
Inventors:
SHIINA TOUKO (JP)
SATO KAZUYA (JP)
ARAI YASUAKI (JP)
SHIMAMIYA MARIKO (JP)
SATO KAZUYA (JP)
ARAI YASUAKI (JP)
SHIMAMIYA MARIKO (JP)
Application Number:
PCT/JP2019/000833
Publication Date:
July 25, 2019
Filing Date:
January 15, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
H05K3/28; B32B15/08; B32B27/00; C08J5/12; C09D201/00; G03F7/004; H05K1/02
Foreign References:
| JP2015104913A | 2015-06-08 | |||
| JP2008060270A | 2008-03-13 | |||
| JP2011068713A | 2011-04-07 | |||
| JP2008248141A | 2008-10-16 | |||
| JPS63234603A | 1988-09-29 | |||
| JP2008053465A | 2008-03-06 | |||
| JP2001015874A | 2001-01-19 | |||
| JP2004534408A | 2004-11-11 |
Other References:
See also references of EP 3742871A4
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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